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AGFD023R24C2I2V
  • image of System On Chip (SoC)>AGFD023R24C2I2V
  • image of System On Chip (SoC)>AGFD023R24C2I2V
Dash number AGFD023R24C2I2V
Product category System On Chip (SoC)
Manufacturer Intel
Type IC
Encapsulation -
Package Tray
Quantity 0
RoHS
Price: $26,156.0700
Stock:
Total

Quantity

Price

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3

$26,156.0700

$78,468.2100

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Product details
image of System On Chip (SoC)>AGFD023R24C2I2V
image of System On Chip (SoC)>AGFD023R24C2I2V
AGFD023R24C2I2V
Dash number
AGFD023R24C2I2V
Product category
System On Chip (SoC)
Manufacturer
Intel
Type
IC
Encapsulation
-
Package
Tray
Quantity
0
RoHS
Product parameter
TYPEDESCRIPTION
MfrIntel
SeriesAgilex F
PackageTray
Product StatusACTIVE
Package / Case2340-BFBGA Exposed Pad
Speed1.4GHz
RAM Size256KB
Number of I/O480
Operating Temperature-40°C ~ 100°C (TJ)
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary AttributesFPGA - 2.3M Logic Elements
ConnectivityEBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDMA, WDT
Supplier Device Package2340-BGA (45x42)
ArchitectureMPU, FPGA
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